Single, Double, Multilayer, HDI, Flex & Rigid‑Flex | IPC‑Class 2/3 | RoHS & REACH compliant | Fast lead times.
Choose the build that fits your project. We support quick‑turn prototypes and scalable production.
Cost‑effective boards for consumer and industrial electronics. HASL/ENIG finishes, solder mask color options.
Tight impedance control, buried/blind vias, micro‑vias, stitched ground. Ideal for networking & compute.
Fine line/space, laser vias, high‑TG laminates and low‑loss materials for RF & high‑speed digital.
Polyimide flex, dynamic bend designs, stiffeners, coverlays & controlled impedance for compact devices.
Superior thermal performance for LEDs and power electronics. 1–3 W/m·K dielectric options.
DFM checks, panel optimization, AOI/X‑ray, flying‑probe/fixture tests, serialization & CoC reports.
Typical limits shown; tighter rules available on request.
| Parameter | Spec | Notes |
|---|---|---|
| Layers | 1–32 | Rigid, Flex, Rigid‑Flex |
| Board Thickness | 0.4–3.2 mm | Custom stack‑ups supported |
| Copper Weight | 0.5–6 oz | Inner/outer layers |
| Min Trace/Space | 3/3 mil | HDI down to 2/2 mil |
| Min Drill | 0.2 mm (mech) | Laser micro‑via 0.1 mm |
| Surface Finish | ENIG, HASL, OSP, Imm‑Ag, Imm‑Sn | Lead‑free standard |
| Solder Mask | Green, Black, White, Blue, Red, Matte | Custom colors on request |
| Silkscreen | White/Black | Legend & serialization |
| Impedance Control | ±10% typical | Coupon measurement |
| Testing | AOI, Flying Probe, ICT | X‑ray for BGA/HDI |
| Compliance | IPC‑A‑600, RoHS, REACH | UL on request |
Simple, engineer‑friendly steps from Gerber to delivery.
Gerber/ODB++, drill & stack‑up. NDA available.
We run DFM checks and send best pricing/lead time.
Controlled processes with AOI, flying‑probe, X‑ray.
Packed with CoC, test reports, and serialization.
From consumer wearables to aerospace & defense.
A glimpse into our shop floor and finished boards.
Upload your Gerbers and get pricing in hours.