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High‑speed | RF | Mixed‑Signal IPC Standards DFM/DFT Ready

Premium PCB Layout & Design for Prototypes to Mass‑Production

We turn schematics into manufacturable boards with controlled impedance, clean return paths, stack‑up planning, and assembly‑ready outputs (Gerbers, ODB++, pick‑and‑place, BOM).

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Avg. lead time for layouts: 3‑10 days depending on complexity.
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Differential Pairs RF / Microwave DDR / USB 3.x PDN Analysis

Why Choose Us

Engineering‑first approach with strong DFM/DFT focus and EMI/EMC best practices.

High‑Speed Expertise

DDR, PCIe, MIPI, USB 3.x with skew/length matching and impedance control.

RF / Microwave

Stack‑ups for low‑loss materials, controlled transitions, and shielding strategy.

Manufacturable

IPC‑7351 footprints, Fab notes, panelization, and assembly‑ready outputs.

Quality & Review

ERC/DRC, checklist‑based peer reviews, and free DFM report with every job.

PCB Design Services

End‑to‑end from schematic capture to assembly files.

PCB Layout

2–20+ layers, analog, digital, mixed‑signal with proper PDN & return paths.

  • Length matching & diff‑pair tuning
  • Impedance controlled routing
  • Thermal relief & copper balance
High‑Speed Design

DDRx, PCIe, Ethernet, HDMI, MIPI with constraints and timing closure.

  • Skew budgeting & xTalk control
  • Via strategy & back‑drilling
  • Stack‑up co‑design with fab
RF & Microwave

50/75Ω lines, microstrip/stripline, controlled transitions & grounding.

  • EMI/EMC best practices
  • Shielding & keep‑out strategy
  • Connector launch tuning
Flex / Rigid‑Flex

Bend radius rules, stiffener planning, and dynamic‑flex reliability.

  • Coverlay openings & teardrops
  • Hatched copper & strain relief
  • ZIF/connector footprints
DFM/DFT Review

Fabrication constraints, assembly checks, test‑point planning & panelization.

  • Solderability & tombstoning checks
  • Pick‑and‑place verification
  • AOI/ICT readiness
Deliverables

Complete outputs for fab & assembly.

  • Gerber/ODB++, drill, fab notes
  • BOM with MPN & alternates
  • Pick‑and‑place, centroid, PDFs

Design Capabilities

We engineer for signal integrity, power integrity, and reliability.

  • Up to 24 layers, blind/buried vias, via‑in‑pad, microvias
  • Impedance control & stack‑up co‑design with fabricator
  • PDN design with stitching vias & decoupling strategy
  • Thermal analysis & copper balancing
  • Compliance oriented (IPC‑2221/7351, RoHS/REACH)
  • Libraries with 3D models & courtyard checks
Altium
KiCad
Cadence Allegro
Mentor Pads

How It Works

Transparent steps from requirement to release.

1. Requirement & NDA

Share schematics, constraints, preferred stack‑up, part libraries, and timelines. We can sign an NDA.

2. Feasibility & Quote

We assess complexity, propose milestones, and share a fixed quote or hourly estimate.

3. Layout Execution

Constraint‑driven routing with periodic design reviews and build‑ready checks.

4. Release & Support

Deliverables: Gerber/ODB++, drill, fab notes, panel, BOM, CPL. Free support until first proto spin.

What We Need for Quoting
  • Schematics (PDF/Source) and block diagram
  • Target board size, layers, interfaces, key ICs
  • Speed classes (e.g., DDR3/4, PCIe Gen, USB 3.x)
  • Specials: impedance, RF, flex, via‑in‑pad, microvia
  • Any preferred standards, fab/assembly house
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FAQ

Answers to common questions.

Gerber/ODB++, drill, fab notes, stack‑up, pick‑and‑place, assembly drawings, BOM with MPN and alternates, PDFs.

Yes. We co‑design stack‑ups and panelization with your vendor and adjust rules to their capabilities.

Absolutely. We can use your NDA or ours before sharing design assets.

Ready to start your PCB design?

Share your schematics and constraints—we’ll revert with a plan and quote.

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